The results obtained by the Air Liquide' Research teams for the improvement of existing processes are described in the following publications.
Electronics
Electronic Packaging & Assembly (EP&A) |
| New Avenues for Wave Soldering and Lead Free Conversion. M. Theriault, A. Rahn Circuit Assembly Magazine; April 2002 (4/1/2002) |
| Cryogenic cooling for temperature chambers and thermal plateforms; Explained and demystified (1/1/2001) |
| Inert Soldering with Lead-Free Alloys: Review and Evaluation. C. Carsac, J. Uner, M. Theriault APEX 2001; San Diego CA,; January 2001 (1/1/2001) |
| The Application Of Atmospheric Pressure Plasma to Various Steps In Integrated Circuit Packaging Jason Uner, Martin Theriault, Claude Carsac, Thierry Sindzingre Semicon West 2000,; San Jose CA, July 2000 (7/1/2000) |
| SMD-Dry; Evaluating Nitrogen Storage As An Alternative To Baking Moisture/Reflow Sensitive Components M. Theriault, P. Blostein, C. Carsac Nepcon West 2000, Anaheim CA, March 2000 (6/1/2000) |
| Tasks for Lead-Free Dr. A. Rahn Nitrogen as a Process Tool Seminar; San Diego CA; February 2000 (2/1/2000) |
| Wave Soldering Under Nitrogen (1/1/2000) |
| Reflow Soldering Under Nitrogen (1/1/2000) |
| Wave & Reflow Soldering Under Nitrogen (1/1/2000) |
| Nitrogen And Soldering: Reviewing The Issue Of Inerting M. Theriault, P. Blostein, A. Rahn Surface Mount Technology Magazine; Pages 52-58, June 2000 (1/1/2000) |
| Liquid Nitrogen Retrofit System for Environmental Test Chamber Conversion - NITROCOOL™ (1/1/2000) |
| Environmental Testing Using Liquid Nitrogen (1/1/2000) |
| Improving The Wave Soldering Process with New Nitrogen Retrofit Systems Theriault, Wolff, Redwitz, Passman Proceedings of Nepcon W. 1999; Anaheim CA; February 1999 (2/1/1999) |
| Tombstoning in Reflow Soldering Operations: Does Inerting Cause Tombstoning? (1/1/1999) |
| NEW APPROACHES HELP REDUCE THE COST OF INERT SOLDERING. Process Adjustments and New On-Site Systems; Address Consumption and Unit Cost. M. Theriault, P. Blostein Circuit Assembly Magazine, July 1998 (7/1/1998) |
Semiconductors |
| Optimizing the selection and supply of Hf precursor candidates for gate oxide R. Inman & all, American Air Liquide, Chicago Research Center, USA A. Misra, Air Liquide Electronics U.S. LP, Dallas, USA N. Blasco & all, Air Liquide Research Center, France S. Anderson & all, Air Liquide Balazs Analytical Services, USA Semiconductor Fabtech July 2005 Paper FT27 - 10/5 (Fabtech Ed) ) |
| Ultra High Purity Delivery of Electronics Specialty Gases. (1/1/2002) |
| Intelligent dry storage cabinet for moisture sensitive devices. (1/1/2002) |
| FabView: Tool for data management and analysis of utilities in semiconductor facility. (1/1/2001) |
| Fab Genius is a Expert System for advanced analysis and prediction of utilities data in semiconductor facilities. (1/1/2001) |
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